The EK720 thermal pads are designed to dissipate heat away from the microchips to dissipate it via a heat sink. As a replacement for aging and low-quality pads, they increase the thermal performance of chip components in laptops, graphics cards, game consoles or other electronics.
EFFICIENT AND EFFECTIVE
The high-quality material makes the EK720 very durable and offers a high thermal conductivity in comparison. The deformable contact surface fills all cavities and gaps between the components and thus ensures a precise connection. The thermal conductivity is 6 W/mK, which was determined by standardized tests, compared to competing products with unclear methods.
SAFE HANDLING AND HIGH USER-FRIENDLINESS
The EK720 is not electrically conductive and can therefore be safely used near electronic components. This makes installation on printed circuit boards with sensitive circuits particularly convenient and easy.
AVAILABLE IN DIFFERENT THICKNESSES AND SIZES
Our thermal pads are available in 0.5 mm, 1.0 mm, 1.5 mm and 2.0 mm. The 0.5 mm variant is an excellent alternative to thermal foils due to its small thickness. Depending on the thickness of the pads, they are available in different sizes.
THE RIGHT SIZE FOR EVERY APPLICATION
The EK720 High Performance Thermal Pad is available in different sizes and thicknesses to meet the requirements of each specific application. Improve the cooling performance of laptops, GPUs, or other electronic devices with integrated circuits that require increased heat dissipation.