Deepcool Thermalpad EK720-XL-2.0

Versatile applications – High-performance thermal pads are applicable to various devices including laptops, graphics cards, game consoles and other electronics.
EFFECTIVE & EFFECTIVE – Thermal pads are a good interface to conducive heat from underlying IC chips to heatsinks where distance is crucial.
SAFE HANDLE & EASY TO USE – Durable and supple, thermal pads are easy to install and safe to use around electronic components.
Different sizes – also available in other sizes and thickness to meet the needs of all specific applications.

VERSATILE

The EK720 thermal pads are designed to dissipate heat away from the microchips to dissipate it via a heat sink. As a replacement for aging and low-quality pads, they increase the thermal performance of chip components in laptops, graphics cards, game consoles or other electronics.

EFFICIENT AND EFFECTIVE

The high-quality material makes the EK720 very durable and offers a high thermal conductivity in comparison. The deformable contact surface fills all cavities and gaps between the components and thus ensures a precise connection. The thermal conductivity is 6 W/mK, which was determined by standardized tests, compared to competing products with unclear methods.

SAFE HANDLING AND HIGH USER-FRIENDLINESS

The EK720 is not electrically conductive and can therefore be safely used near electronic components. This makes installation on printed circuit boards with sensitive circuits particularly convenient and easy.

AVAILABLE IN DIFFERENT THICKNESSES AND SIZES

Our thermal pads are available in 0.5 mm, 1.0 mm, 1.5 mm and 2.0 mm. The 0.5 mm variant is an excellent alternative to thermal foils due to its small thickness. Depending on the thickness of the pads, they are available in different sizes.

THE RIGHT SIZE FOR EVERY APPLICATION

The EK720 High Performance Thermal Pad is available in different sizes and thicknesses to meet the requirements of each specific application. Improve the cooling performance of laptops, GPUs, or other electronic devices with integrated circuits that require increased heat dissipation.

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